JPH0577690B2 - - Google Patents
Info
- Publication number
- JPH0577690B2 JPH0577690B2 JP63036434A JP3643488A JPH0577690B2 JP H0577690 B2 JPH0577690 B2 JP H0577690B2 JP 63036434 A JP63036434 A JP 63036434A JP 3643488 A JP3643488 A JP 3643488A JP H0577690 B2 JPH0577690 B2 JP H0577690B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- composition
- weight
- filler
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000203 mixture Substances 0.000 claims description 70
- 239000003822 epoxy resin Substances 0.000 claims description 56
- 229920000647 polyepoxide Polymers 0.000 claims description 56
- 239000000945 filler Substances 0.000 claims description 49
- 239000002245 particle Substances 0.000 claims description 27
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 26
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 25
- 238000000465 moulding Methods 0.000 claims description 21
- 238000001746 injection moulding Methods 0.000 claims description 17
- 239000010419 fine particle Substances 0.000 claims description 16
- 239000000377 silicon dioxide Substances 0.000 claims description 11
- 150000008064 anhydrides Chemical class 0.000 claims description 9
- 239000003054 catalyst Substances 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 9
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 9
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 9
- 125000003118 aryl group Chemical group 0.000 claims description 8
- 238000002347 injection Methods 0.000 claims description 7
- 239000007924 injection Substances 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 4
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical group C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 claims description 2
- VUFBCWUJICCKDU-UHFFFAOYSA-N 1-(2-methylimidazol-1-yl)propan-2-ol Chemical group CC(O)CN1C=CN=C1C VUFBCWUJICCKDU-UHFFFAOYSA-N 0.000 claims description 2
- CXXSQMDHHYTRKY-UHFFFAOYSA-N 4-amino-2,3,5-tris(oxiran-2-ylmethyl)phenol Chemical compound C1=C(O)C(CC2OC2)=C(CC2OC2)C(N)=C1CC1CO1 CXXSQMDHHYTRKY-UHFFFAOYSA-N 0.000 claims description 2
- 229940106691 bisphenol a Drugs 0.000 claims description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 2
- 239000007795 chemical reaction product Substances 0.000 claims 1
- 239000000463 material Substances 0.000 description 13
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 12
- 239000003677 Sheet moulding compound Substances 0.000 description 8
- 230000007423 decrease Effects 0.000 description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 6
- 229910001315 Tool steel Inorganic materials 0.000 description 5
- 239000004413 injection moulding compound Substances 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 4
- 229920003319 Araldite® Polymers 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 3
- 229920013683 Celanese Polymers 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- -1 boron trichloride amine Chemical class 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 238000009415 formwork Methods 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 241000218378 Magnolia Species 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 239000011505 plaster Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- FAUAZXVRLVIARB-UHFFFAOYSA-N 4-[[4-[bis(oxiran-2-ylmethyl)amino]phenyl]methyl]-n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC(CC=2C=CC(=CC=2)N(CC2OC2)CC2OC2)=CC=1)CC1CO1 FAUAZXVRLVIARB-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- RIWRFSMVIUAEBX-UHFFFAOYSA-N n-methyl-1-phenylmethanamine Chemical compound CNCC1=CC=CC=C1 RIWRFSMVIUAEBX-UHFFFAOYSA-N 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000010125 resin casting Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- JIYNFFGKZCOPKN-UHFFFAOYSA-N sbb061129 Chemical compound O=C1OC(=O)C2C1C1C=C(C)C2C1 JIYNFFGKZCOPKN-UHFFFAOYSA-N 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000007655 standard test method Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 230000002110 toxicologic effect Effects 0.000 description 1
- 231100000027 toxicology Toxicity 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15,997 | 1987-02-18 | ||
| US07/015,997 US4732962A (en) | 1987-02-18 | 1987-02-18 | High temperature epoxy tooling composition of bisphenol-A epoxy, trifunctional epoxy, anhydride curing agent and an imidazole catalyst |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63223028A JPS63223028A (ja) | 1988-09-16 |
| JPH0577690B2 true JPH0577690B2 (en]) | 1993-10-27 |
Family
ID=21774790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63036434A Granted JPS63223028A (ja) | 1987-02-18 | 1988-02-18 | 高温成形型用エポキシ樹脂組成物 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4732962A (en]) |
| EP (1) | EP0279516B1 (en]) |
| JP (1) | JPS63223028A (en]) |
| AU (1) | AU605234B2 (en]) |
| CA (1) | CA1301984C (en]) |
| DE (1) | DE3882056T2 (en]) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0668012B2 (ja) * | 1987-09-15 | 1994-08-31 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 封止用組成物及び前記組成物を用いた電子装置 |
| US4920161A (en) * | 1988-06-24 | 1990-04-24 | General Motors Corporation | High strength epoxy tooling compositions |
| US4925886A (en) * | 1989-01-23 | 1990-05-15 | General Motors Corporation | High temperature epoxy tooling composition of bifunctional epoxy, trifunctional epoxy, anhydride, imidazole and interstitially matched filler |
| US4931528A (en) * | 1989-05-08 | 1990-06-05 | Texaco Chemical Company | 1-isopropyl-2-methyl imidazole as an epoxy resin curative |
| EP0734074A1 (en) * | 1990-07-16 | 1996-09-25 | Nitto Denko Corporation | Photosemiconductor device |
| US5189118A (en) * | 1991-02-28 | 1993-02-23 | Texaco Chemical Company | Mixtures of 1-isopropyl-2-aryl imidazole and 1-isopropyl-2-aryl imidazoline as epoxy resin curatives |
| US5260014A (en) * | 1991-06-13 | 1993-11-09 | Automotive Plastic Technologies | Method of making a multilayer injection mold |
| JPH05214214A (ja) * | 1992-02-06 | 1993-08-24 | Mitsubishi Petrochem Co Ltd | エポキシ樹脂組成物及びその硬化物 |
| DE4211250A1 (de) * | 1992-04-03 | 1993-10-07 | Siemens Ag | Reaktionsharze zum Vergießen von druckempfindlichen elektronischen Bauelementen |
| US5427676A (en) * | 1993-08-10 | 1995-06-27 | General Motors Corporation | Method of making a cast-to-size mold for molding finished plastic parts |
| CA2248730A1 (en) * | 1996-03-22 | 1997-10-02 | Teruko Uchimi Miyazaki | One-component epoxy resin tooling material |
| US5691402A (en) * | 1996-09-13 | 1997-11-25 | Composite Technology Group, Llc | Composite tooling material having vinyl ester resins and fillers |
| BR9806065A (pt) * | 1997-07-24 | 1999-08-31 | Loctite Corp | Composições de resina termossensível ·teis como vedantes entre camadas |
| US6060540A (en) * | 1998-02-13 | 2000-05-09 | Landec Corporation | Modeling pastes |
| US6632893B2 (en) | 1999-05-28 | 2003-10-14 | Henkel Loctite Corporation | Composition of epoxy resin, cyanate ester, imidazole and polysulfide tougheners |
| US6309587B1 (en) | 1999-08-13 | 2001-10-30 | Jeffrey L. Gniatczyk | Composite molding tools and parts and processes of forming molding tools |
| KR100417067B1 (ko) * | 2000-12-05 | 2004-02-05 | 주식회사 엘지화학 | 에폭시 수지 조성물 및 이를 이용한 저유전율 동박 적층판 |
| DE10144871A1 (de) * | 2001-09-12 | 2003-03-27 | Bosch Gmbh Robert | Vergußmasse mit hoher thermischer Stabilität |
| US20040249044A1 (en) * | 2003-02-18 | 2004-12-09 | Tuan Nguyenquang | High temperature resistant coating composition |
| JP4731566B2 (ja) * | 2004-11-17 | 2011-07-27 | ハンツマン・アドヴァンスト・マテリアルズ・（スイッツランド）・ゲーエムベーハー | 高温抵抗性のひな型又は金型の製造方法 |
| EP4200927A4 (en) | 2020-08-24 | 2024-06-05 | Green Li-Ion Pte. Ltd. | Process for removing impurities in the recycling of lithium-ion batteries |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3265647A (en) * | 1962-01-29 | 1966-08-09 | Armstrong Cork Co | Trowelable epoxy-polyamide composition with graded filler |
| US3313007A (en) * | 1963-08-22 | 1967-04-11 | Gen Motors Corp | Method of making sheet metal forming dies |
| US3329652A (en) * | 1965-02-15 | 1967-07-04 | Shell Oil Co | Process for curing polyepoxides with anhydrides and activators therefor |
| DE1956066A1 (de) * | 1968-12-10 | 1971-04-08 | Pumpen & Verdichter Veb K | Verfahren zum Herstellen von haertbaren Giessharzen fuer verschleissfeste,korrosionsbestaendige selbsttragende Bauteile |
| US3658750A (en) * | 1969-02-13 | 1972-04-25 | Hitachi Ltd | Thermosetting resin composition and electrical appliances using the same |
| JPS5124399B2 (en]) * | 1973-03-19 | 1976-07-23 | ||
| US4031059A (en) * | 1974-01-21 | 1977-06-21 | Martin Marietta Corporation | Low density ablator compositions |
| US4002599A (en) * | 1975-11-06 | 1977-01-11 | Lord Corporation | Epoxy resin compositions from glycidyl derivatives of aminophenols cured with tetracarboxylic dianhydrides |
| JPS559626A (en) * | 1978-07-07 | 1980-01-23 | Ube Ind Ltd | Epoxy resin composition |
| US4346207A (en) * | 1980-08-11 | 1982-08-24 | Ciba-Geigy Corporation | Flowable, curable epoxy resin mixture |
| US4374076A (en) * | 1981-10-09 | 1983-02-15 | Coors Porcelain Company | Method for making cast epoxy resin bodies and epoxy formulation therefor |
| US4423094A (en) * | 1982-11-12 | 1983-12-27 | General Motors Corporation | Durable cast epoxy tooling composition |
| NZ212747A (en) * | 1984-07-17 | 1989-01-27 | Dow Chemical Co | Partially advanced epoxy resin compositions |
| GB8519290D0 (en) * | 1985-07-31 | 1985-09-04 | Dow Chemical Rheinwerk Gmbh | Resin composition |
| US4920161A (en) * | 1988-06-24 | 1990-04-24 | General Motors Corporation | High strength epoxy tooling compositions |
-
1987
- 1987-02-18 US US07/015,997 patent/US4732962A/en not_active Expired - Fee Related
- 1987-09-15 CA CA000546889A patent/CA1301984C/en not_active Expired - Lifetime
-
1988
- 1988-01-20 EP EP88300437A patent/EP0279516B1/en not_active Expired - Lifetime
- 1988-01-20 DE DE88300437T patent/DE3882056T2/de not_active Expired - Fee Related
- 1988-01-29 AU AU10964/88A patent/AU605234B2/en not_active Ceased
- 1988-02-18 JP JP63036434A patent/JPS63223028A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| CA1301984C (en) | 1992-05-26 |
| DE3882056D1 (de) | 1993-08-05 |
| AU1096488A (en) | 1988-08-25 |
| AU605234B2 (en) | 1991-01-10 |
| EP0279516A3 (en) | 1990-09-05 |
| US4732962A (en) | 1988-03-22 |
| DE3882056T2 (de) | 1993-10-07 |
| EP0279516B1 (en) | 1993-06-30 |
| EP0279516A2 (en) | 1988-08-24 |
| JPS63223028A (ja) | 1988-09-16 |
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